ʻO ka pōmaikaʻi o nā panela manual Dong`an
A:Loaʻa i kā mākou mau papa waiho anu anuanu ke kūpaʻa deformation ikaika, ʻaʻole maʻalahi i ka haki ʻana, a ʻoi aku ka paʻa.
B:ʻOi aku ka haʻahaʻa o ka coefficient thermal conductivity, maʻamau ma waena o 0.019 a me 0.022w/mk (25) no ka papa kumu, aʻo kā mākou papa mālama anu hiki ke loaʻa i ka coefficient conductivity thermal o 0.018. He haʻahaʻa ka coefficient conductivity thermal, a ʻoi aku ka kiʻekiʻe o ka hana insulation. Eia hou, ua loaʻa i kā mākou papa mālama anuanu kahi hana ʻōnaehana pale a me ka wai.
C:E hōʻike ana i ke kūpaʻa ahi, ka pale ʻana i ka lapalapa, ke kūpaʻa wela kiʻekiʻe, a me ka hopena insulation kani maikaʻi
Nā pōmaikaʻi holoʻokoʻa: Hoʻokahi kūʻai kūʻai mai Dongʻan.
ʻO ka hui ʻoihana ʻo Dong`an he ʻoihana huahana nona kahi hui R&D kūʻokoʻa, hāʻawi iā ʻoe i ka hana maikaʻi loa. ʻO nā lawelawe hoʻohui ʻoihana no ka hoʻolālā, hana ʻana, a me ka logistic e hōʻoluʻolu iā ʻoe.
E nīnau iā mākou no nā mea āu e makemake ai i kēia manawa